Clarkson University is the recipient of a $50,000 grant from FuzeHub, a not-for-profit organization providing small to medium-sized manufacturers with guided access to an extensive network of industry experts, programs, and resources to solve business growth challenges.

The grant was awarded to Clarkson’s The Center for Advanced Materials Processing (CAMP)/ Mosaic Microsystems, LLC for planarization methods for manufacturing glass substrates for packaging advanced semiconductor chips.

This project aims to develop a CMP process for manufacturing advanced substrates using thin glass wafers. Current challenges include non-uniform filling and limited availability of suitable CMP slurries for thin glass, resulting in low device yield. To overcome these challenges, the project aims to create a planarization process and integrate a Cu CMP process into Mosaic’s TGVs process. This will enable high yields, uniform TGV filling, and a smooth surface for thin glass wafers, crucial for high-performance semiconductor chip packaging in New York, according to a FuzeHub email.