Clarkson University engineering graduate student Naresh K. Penta won the Best Poster Award at the International Conference on Planarization/CMP Technology in Phoenix, last month.
His poster, "Effect of polishing pads on tunable removal rates of polysilicon over silicon dioxide and silicon nitride films," was co-authored by P. R. Dandu Veera (now of Intel Corporation) and Clarkson Professor S. V. Babu, Penta's research advisor.
The annual conference provides an international forum for academic researchers, industrial practitioners and engineers from around the world to exchange information on state-of-the-art research in chemical-mechanical planarization (CMP) technology.
It is the biggest conference in the field of CMP with more than 250 participants. Corporations like Intel, IBM, IMEC, Dow, and Samsung discussed issues and future challenges in CMP.
Students from MIT, the University of California, Berkeley, the University of Arizona, Korea's Hanyang University, and Japan's Kyushu University competed for the poster prize.